HBM2E记忆

Solving the toughest challenges requires a compute foundation with fast memory. Our HBM2E delivers the necessary performance, massive parallelism and power efficiency for next-generation data centers and high-performance compute systems.

When nothing else matters but speed. Rebecca Lewington talks with 微米 VP Akshay Singh, who leads the R&D team that created 微米’s amazing HBM2E记忆 in-package memory. TSV interconnect is just one thing that makes our stacked memory so fast.